Sponsored by:nxp_logo_color


Wi-Fi technology continues to evolve with new standards, such as Wi-Fi 6, Wi-Fi 6E, and Wi-Fi 7, expected to dominate the Wi-Fi market landscape over the next few years. These technologies will enable Wi-Fi to improve performance within existing use cases and open up many new opportunities within a variety of consumer, automotive, industrial, and other Internet of Things (IoT) applications.

However, in order to address these markets effectively, Wi-Fi vendors must increasingly provide scalable solutions that can support both lower-end IoT applications that are optimized for cost and power efficiency and high-performance solutions that can maximize the inherent advantages of new standards to better address the ever-changing requirements of demanding access, automotive, consumer, and industrial markets. At the same time, increased integration with other wireless connectivity technologies, such as Bluetooth, Zigbee, Thread, Ultra-Wideband (UWB), and Near Field Communication (NFC), among others, to better support a wide range of emerging use cases that can take advantage of the unique strengths of each, will also be beneficial.

In addition, as Wi-Fi supports new bands, targets new use cases, and attempts to improve performance, Radio Frequency Front-End (RFFE) improvements must also be made. RFFE solutions that are capable of scaling from low-end 1x1 to high-end 8x8 solutions, that can provide efficiencies in terms of cost, size, and power consumption, and that can be easily developed, designed, and integrated will be critical in easing the transition to new Wi-Fi standards across a number of verticals.

The availability of turnkey solutions that can address these varied markets will help reduce time-to-market and further accelerate the shift toward new Wi-Fi standards, such as Wi-Fi 6, 6E, and, in the future, Wi-Fi 7. Leading Wi-Fi and wireless connectivity chipset vendors, such as NXP, offer diverse Wi-Fi 6, Wi-Fi 6E, and other connectivity chipset portfolios, alongside innovative RFFE Integrated Circuits (ICs) that can help better address these varied market demands.

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How Wi-Fi 6 is Driving the Next Wave of Wireless Innovation